AT&S to sell South Korea PCB plant
May 17, 2024
Advanced Technologies & Solutions (AT&S), an Austria-based PCB and IC substrate manufacturer, has confirmed it will divest its facility in Ansan, South Korea.
Taiflex Scientific officially opens Thai factory
May 17, 2024
Taiflex Scientific, a specialist in advanced flexible printed circuit (FPC) materials, has held the grand opening ceremony of its plant in Amata City, Thailand.
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Honda and IBM sign MOU on automotive computing
May 17, 2024
Japanese car giant Honda has sealed an agreement with US computing pioneer IBM to research the tech needed to develop the software-defined vehicles (SDV) of the future.
TRI opens new manufacturing facility
May 16, 2024
Test and inspection systems provider, Test Research, Inc. (TRI), has opened its latest expansion – a new R&D and manufacturing facility in Taiwan.
SiPearl partners with Samsung for built-in HBM in Rhea
May 15, 2024
SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung to equip its Rhea series with the South Korean company's memory solution.
Kevin O’Buckley to lead Foundry Services at Intel
May 14, 2024
Stuart Pann, Senior Vice President and General Manager of Foundry Services, will retire from Intel after 35 years of service at the end of May. He will be succeeded by Kevin O’Buckley.
New microcapacitor tech has 170x more power density
May 13, 2024
Scientists at Lawrence Berkeley National Laboratory have created a new thin film microcapacitor technology that could transform the size and energy efficiency of personal electronic devices.
US Commerce Department reveals new set of Huawei chip bans
May 10, 2024
The US government has revoked licenses that let companies including Intel and Qualcomm sell their chips to Chinese telco firm Huawei.
Americans dominate European patents
May 09, 2024
The European Patent Office (EPO) wrote in a recent report that innovations in digital technologies and clean energy have boosted demand for patents in Europe in 2023, with companies and inventors filing a record number of patent applications.
Power Integrations to acquire assets of Odyssey Semiconductor
May 08, 2024
High-voltage integrated circuits specialist, Power Integrations, has agreed to acquire the assets of Odyssey Semiconductor Technologies, a developer of vertical gallium-nitride (GaN) transistor technology.
Beacon EmbeddedWorks has acquired Diamond Technologies
May 06, 2024
The two US firms say they will now team up to 'accelerate the development of new embedded products for the market, while opening new opportunities for growth.'
Mindgrove launches first made-in-India SoC chip
May 06, 2024
The Chennai-based fabless semiconductor startup says its Secure IoT product is 30% cheaper than competitors.
Powertech to boost CAPEX by 50% to meet demand for memory
May 06, 2024
Chip testing and packaging provider Powertech Technology Inc has revealed it will spend USD 460 million on advanced capacity and equipment.
PSMC officially opens Tongluo Fab in Taiwan
May 03, 2024
Powerchip Semiconductor Manufacturing Corporation (PSMC) has held a grand opening ceremony for its new facility at the Miaoli Tongluo Science Park.
Belgian VC allocates $320m to chip and nanotech startups
May 03, 2024
imec.xpand has launched of a new fund "aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations."
Kulicke & Soffa receives major order for advanced ball bonding
May 02, 2024
Kulicke and Soffa Industries has received a sizeable order from a fast-growing Assembly and Test customer. The order consists of 1,000 RAPID Pro systems, upgraded with the latest ProSuite response-based bonding and looping processes.
ZF and Foxconn completes formation of JV
May 02, 2024
Automotive supplier ZF Friedrichshafen and EMS provider Foxconn, have completed the establishment of their joint venture in the field of passenger car chassis systems.
Siemens opens research hub north of Munich
May 01, 2024
Siemens has opened the first building complex of the Siemens Technology Center (STC) at Garching Research Campus, north of Munich, Germany.
Fraunhofer to expand its collaboration with South Korea
April 30, 2024
Working together to expedite technological innovations in the fields of battery cell and semiconductor technology. That is the aim of an international collaboration program funded by the Korean Ministry of Trade, Industry and Energy (MOTIE).
Thin-film electronics can be 'fabbed', say researchers
April 29, 2024
New research by KU Leuven and imec concludes that the foundry production model can be applied to the field of flexible thin-film electronics.
IBM plans $730m expansion of Canadian chip operation
April 29, 2024
IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant in Bromont, Quebec.
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TSMC: A16 manufacturing will start in 2026
April 26, 2024
The race is on to manufacture the worlds fastest chips, and TSMC has just made a bold claim to be winning it.
TTM opens its first manufacturing facility in Penang
April 25, 2024
PCB manufacturer TTM Technologies has officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD 200 million (approximately MYR 958 million).
TTM Technologies invests in Inovaxe’s SREX Racks
April 25, 2024
During the recent 2024 IPC APEX Expo TTM Technologies chose to invest SREX Racks from Inovaxe, directly off the show.
Thomas Gottwald takes on the role of CTO at Schweizer
April 24, 2024
The Supervisory Board of Schweizer Electronic AG has appointed Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of years with effect from 1 May 2024.
ZF opens automotive technology center in Mexico.
April 23, 2024
Mobility technology company ZF has officially opened the campus that will house four corporate function hubs for North America and the company's first R&D center in Monterrey, Mexico.
UCT opens new manufacturing facility in Malaysia
April 23, 2024
Ultra Clean Holdings, Inc. (UCT), has officially inaugurated its new manufacturing facility in Pulau Pinang. The new facility represents an investment of MYR 250 million (about EUR 49 million).
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Hitachi and Sagar Semi agree MoU on high-power devices
April 19, 2024
Hitachi's Power Semiconductor Device (HPSD) division has agreed a deal to help India's Sagar Semiconductors to build a new facility to produce high-voltage semiconductors for the automotive industry.
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